Invention Publication
- Patent Title: INTEGRATED-TYPE COUPLED INDUCTOR AND RELATED MANUFACTURING METHOD
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Application No.: US18203055Application Date: 2023-05-29
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Publication No.: US20230395320A1Publication Date: 2023-12-07
- Inventor: Chih-Ho Liu , Jui-Wen Kuo , Chi-Ming Huang , Bo-Yu Huang , Yao-Tsung Chen
- Applicant: DARFON ELECTRONICS CORP.
- Applicant Address: TW Taoyuan City
- Assignee: DARFON ELECTRONICS CORP.
- Current Assignee: DARFON ELECTRONICS CORP.
- Current Assignee Address: TW Taoyuan City
- Priority: TW 1137814 2022.10.05
- Main IPC: H01F41/04
- IPC: H01F41/04 ; H01F27/29 ; H01F27/06

Abstract:
An integrated-type coupled inductor is applied to a related manufacturing method and includes a lead frame, a first coil, a second coil and a magnetic packing component. The lead frame has a first surface and a second surface opposite to each other and includes four pins. The first coil is disposed on the first surface and coupled to two of the four pins. The second coil is disposed on the second surface and coupled to other pins. The magnetic packing component covers the first coil and the second coil to expose parts of the four pins.
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