- 专利标题： LOW EMF INFRARED RADIANT PANEL
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申请号： US18255556申请日： 2021-03-26
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公开(公告)号： US20230398373A1公开(公告)日： 2023-12-14
- 发明人: Jui-Hsing Lee , Aaron Michael Zack , Dustin Stevens
- 申请人： Sunlighten, Inc.
- 申请人地址： US KS Overland Park
- 专利权人： Sunlighten, Inc.
- 当前专利权人： Sunlighten, Inc.
- 当前专利权人地址： US KS Overland Park
- 优先权： CN 2011568541.6 2020.12.25
- 国际申请： PCT/US2021/024507 2021.03.26
- 进入国家日期： 2023-06-01
- 主分类号： A61N5/06
- IPC分类号： A61N5/06
摘要：
An infrared radiant panel is formed by overlaid substrates having conductors thereon which are electrically activated to generate heat to cause infrared radiation of desired wavelengths. The conductors are arranged to cancel magnetic fields caused by current flow therethrough. A conductive shield further suppresses fields generated by the panel.
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