- 专利标题: ELECTRONIC DEVICE INCLUDING ACOUSTIC MODULE
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申请号: US17971733申请日: 2022-10-24
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公开(公告)号: US20230044796A1公开(公告)日: 2023-02-09
- 发明人: Heecheul MOON , Sangyoup SEOK , Kwonho SON , Jongchul CHOI
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2019-0079447 20190702
- 主分类号: H04R1/02
- IPC分类号: H04R1/02 ; G06F1/16
摘要:
An electronic device is provided. The electronic device may include: a housing including a cover and at least one first opening; a first acoustic module comprising a speaker disposed in an internal space of the housing; and at least one path configured to guide sound signals generated by the first acoustic module to an outside, the at least one path including: a first space defined by the first acoustic module and at least a portion of the housing; a second space connecting the first space to the first opening and configured to guide a sound signal having a first frequency band toward the first opening; and a third space connecting the first space to a second opening at least partially provided between the housing and the cover and configured to guide a sound signal having a second frequency band lower than the first frequency band toward the second opening.
公开/授权文献
- US11917347B2 Electronic device including acoustic module 公开/授权日:2024-02-27
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