Invention Application
- Patent Title: Thermoset Sealant Film
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Application No.: US17406184Application Date: 2021-08-19
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Publication No.: US20230054693A1Publication Date: 2023-02-23
- Inventor: Hyo Chang (Chris) Yun , Lei Wang
- Applicant: TE Connectivity Services GmbH
- Applicant Address: CH Schaffhausen
- Assignee: TE Connectivity Services GmbH
- Current Assignee: TE Connectivity Services GmbH
- Current Assignee Address: CH Schaffhausen
- Main IPC: B32B27/20
- IPC: B32B27/20 ; B32B27/38 ; B32B27/08 ; B29C70/84 ; H01R13/405 ; H01R13/52
Abstract:
A thermoset sealant film includes an epoxy and a hardener. The hardener is integrated with the epoxy and remains physically distinct from the epoxy in a formed state of the thermoset sealant film.
Information query
