- 专利标题： Laminated Component Carrier With a Thermoplastic Structure
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申请号： US18045376申请日： 2022-10-10
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公开(公告)号： US20230054846A1公开(公告)日： 2023-02-23
- 发明人: Thomas KRIVEC
- 申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 申请人地址： AT Leoben
- 专利权人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人地址： AT Leoben
- 优先权： DE102016105737.1 20160330
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/18 ; H05K3/00 ; H05K3/46
摘要：
A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.
公开/授权文献
- US12048089B2 Laminated component carrier with a thermoplastic structure 公开/授权日：2024-07-23
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