Invention Application
- Patent Title: SHOE WITH CUT IN THE SOLE
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Application No.: US17890944Application Date: 2022-08-18
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Publication No.: US20230062543A1Publication Date: 2023-03-02
- Inventor: Kenta TATENO , Hiroaki NISHIMURA , Takayuki KOGURE , Yoshikazu MITSUHATA , Hiromichi OTAKE
- Applicant: ASICS CORPORATION
- Applicant Address: JP Kobe-shi
- Assignee: ASICS CORPORATION
- Current Assignee: ASICS CORPORATION
- Current Assignee Address: JP Kobe-shi
- Priority: JP2021136888 20210825
- Main IPC: A43B13/18
- IPC: A43B13/18

Abstract:
A shoe includes a sole with a midsole, and an upper portion joined to the sole. The midsole includes a cut having a linear shape, and a depth from a first height position to a second height position in a thickness direction. The cut is configured such that a part of the cut has no contact point with an other part of the cut, and the cut forms a V shape at the deepest part on a cross section when opposite inner walls of the cut are spaced from each other.
Information query