- 专利标题： STRUCTURE AND FORMATION METHOD OF PACKAGE WITH WARPAGE-CONTROL ELEMENT
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申请号： US17461567申请日： 2021-08-30
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公开(公告)号： US20230062783A1公开(公告)日： 2023-03-02
- 发明人: Yu-Sheng LIN , Chien-Hung CHEN , Po-Chen LAI , Po-Yao LIN , Shin-Puu JENG
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L25/18 ; H01L25/00
摘要：
A package structure and a formation method of a package structure are provided. The package structure includes a circuit substrate and a die package bonded to the circuit substrate through bonding structures. The package structure also includes a warpage-control element attached to the circuit substrate. The warpage-control element has a protruding portion extending into the circuit substrate. The warpage-control element has height larger than that of the die package.
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