发明申请
- 专利标题： POWER MODULE
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申请号： US17909471申请日： 2021-03-08
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公开(公告)号： US20230114396A1公开(公告)日： 2023-04-13
- 发明人: Ole MÜHLFELD , Klaus OLESEN , Matthias BECK , Holger ULRICH , Martin BECKER
- 申请人： Danfoss Silicon Power GmbH
- 申请人地址： DE Flensburg
- 专利权人： Danfoss Silicon Power GmbH
- 当前专利权人： Danfoss Silicon Power GmbH
- 当前专利权人地址： DE Flensburg
- 优先权： DE102020106385.7 20200309
- 国际申请： PCT/EP2021/055804 WO 20210308
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/373
摘要：
A power module (2) including a rigid insulated substrate (10) mounted on a baseplate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the baseplate (4) adjacent to the rigid insulated substrate (10). The additional circuit carrier (6, 8) has a rigidity which is less than that of the rigid insulated substrate (10).