A light-emitting module including a first wiring substrate, a second wiring substrate located on the first wiring substrate, a plurality of light-emitting elements located on the second wiring substrate, a wire connecting a first terminal of the first wiring substrate and a second terminal of the second wiring substrate, a first resin located on the first wiring substrate and on the second wiring substrate, and a protective member located on the first resin. The first resin covers the wire and surrounds the plurality of light-emitting elements when viewed in plan view. The protective member includes a light-transmitting member covering the first resin when viewed in plan view, and a light-shielding film located at a surface of the light-transmitting member. The light-shielding film covers the first resin when viewed in plan view.