- 专利标题: IMPLANTABLE MEDICAL DEVICES HAVING MODULAR LEAD BORES
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申请号: US18086224申请日: 2022-12-21
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公开(公告)号: US20230127724A1公开(公告)日: 2023-04-27
- 发明人: Darren A. Janzig , Andrew Thom , Brad Tischendorf , Randy S. Roles , Steven T. Deininger , Nicholas R. Whitehead
- 申请人: MEDTRONIC, INC.
- 申请人地址: US MN Minneapolis
- 专利权人: MEDTRONIC, INC.
- 当前专利权人: MEDTRONIC, INC.
- 当前专利权人地址: US MN Minneapolis
- 主分类号: A61N1/375
- IPC分类号: A61N1/375
摘要:
Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
公开/授权文献
- US11890484B2 Implantable medical devices having modular lead bores 公开/授权日:2024-02-06
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