Invention Application
- Patent Title: MULTI-CHIP MODULE LEADLESS PACKAGE
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Application No.: US18086981Application Date: 2022-12-22
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Publication No.: US20230129232A1Publication Date: 2023-04-27
- Inventor: Matthew David Romig , Wei Zhang , Mohammad Waseem Hussain , Peter Anthony Fundaro
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/50 ; H01L25/065 ; H01L25/16 ; H02M3/158

Abstract:
A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.
Public/Granted literature
- US12142550B2 Multi-chip module leadless package Public/Granted day:2024-11-12
Information query
IPC分类: