- 专利标题: MULTILAYER CAPACITOR
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申请号: US17570576申请日: 2022-01-07
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公开(公告)号: US20230130377A1公开(公告)日: 2023-04-27
- 发明人: Jeong Wook SEO , Hee Sun CHUN , Tae Hyung KIM , Hui Sun PARK , Hyeg Soon AN , Hyo Ju LEE , Jin Woo KIM , Seok Hyun YOON
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2021-0141711 20211022
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/12 ; H01G4/012 ; H01G4/008
摘要:
A multilayer capacitor includes a body including a laminate structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer therebetween, and first and second external electrodes spaced apart on the body, to be connected to at least one first internal electrode and at least one second internal electrode, respectively. The body includes, in a larger molar content, at least one selected from the group consisting of Dy, Tb, Y, Sm, Ho, Gd, Er, Ce, La and Nd in a capacitance formation region including a region between at least one first internal electrode and at least one second internal electrode than in a margin region including a region between a boundary line of at least one first internal electrode and at least one second internal electrode and a surface of the body.
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