Invention Application
- Patent Title: SURFACE-MOUNT ELECTRONIC COMPONENT AND CIRCUIT BOARD HAVING THE SAME
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Application No.: US17971137Application Date: 2022-10-21
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Publication No.: US20230132354A1Publication Date: 2023-04-27
- Inventor: Tomonaga NISHIKAWA , Masaki ENDO , Masaki YONEYAMA , Osamu NAKADA , Hironori SATO , Ryota NAITO
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2021-172992 20211022
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18

Abstract:
Disclosed herein is a surface-mount electronic component that includes a main body part having a mounting surface, a first terminal electrode provided on one end side of the mounting surface in a long side direction thereof, and a second terminal electrode provided on other end side of the mounting surface in the long side direction thereof. Each of the first and second terminal electrode includes a main area extending in a short side direction of the mounting surface and a protruding part provided at a center portion in the short side direction so as to protrude from the main area to an end portion of the mounting surface in the long side direction.
Public/Granted literature
- US12273999B2 Surface-mount electronic component and circuit board having the same Public/Granted day:2025-04-08
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