A combined electrohydrodynamic (EHD) and dielectrophoretic (DEP) cooling approach for a processor or similar electronics in a zero gravity environment is beneficial in space exploration. An EHD pumping mechanism is defined by an array of alternating, polarized electrodes surrounding a heat sink coupled to the processor for heat exchange, such as a thermally conductive layer or coating. The array may be circular, rectangular, or any suitable geometry, generally guided by a shape of the heat sink/processor. Cooling fluid is drawn or pumped towards the heat sink by EHD electrodes, and a dielectrophoretic (DEP) electrode disposed above the center of the heat sink extracts the generated vapor bubbles away from the heated surface with a diverging electrical field. One configuration calls for a radial arrangement of EHD electrodes drawing the cooling fluid towards a centrally located heat sink.