Invention Application
- Patent Title: LOGIC CELL LAYOUT DESIGN FOR HIGH DENSITY TRANSISTORS
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Application No.: US17515914Application Date: 2021-11-01
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Publication No.: US20230132912A1Publication Date: 2023-05-04
- Inventor: James P. Mazza , Elizabeth Strehlow , Motoi Ichihashi , Xuelian Zhu , Jia Zeng
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US NY Malta
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US NY Malta
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L23/528

Abstract:
The present disclosure relates to semiconductor structures and, more particularly, to a logic cell layout design for high density transistors and methods of manufacture. The structure includes a plurality of active gates in a high density transistor, and at least one dummy gate which is continuous and is adjacent to at least one active gate of the active gates in a multi-row cell of the high density transistor.
Public/Granted literature
- US12046651B2 Logic cell layout design for high density transistors Public/Granted day:2024-07-23
Information query
IPC分类: