Invention Application
- Patent Title: RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF
-
Application No.: US17541280Application Date: 2021-12-03
-
Publication No.: US20230135098A1Publication Date: 2023-05-04
- Inventor: Yi Yu Lin , Po Kai Hsu , Chun-Hao Wang , Yu-Ru Yang , Ju Chun Fan , Chung Yi Chiu
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Priority: CN202111300233.X 20211104
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
Provided are a resistive random access memory and a manufacturing method thereof. The resistive random access memory includes a substrate having a pillar protruding from a surface of the substrate, a gate surrounding a part of a side surface of the pillar, a gate dielectric layer, a first electrode, a second electrode, a variable resistance layer, a first doped region and a second doped region. The gate dielectric layer is disposed between the gate and the pillar. The first electrode is disposed on a top surface of the pillar. The second electrode is disposed on the first electrode. The variable resistance layer is disposed between the first electrode and the second electrode. The first doped region is disposed in the pillar below the gate and in a part of the substrate below the pillar. The second doped region is disposed in the pillar between the gate and the first electrode.
Public/Granted literature
- US11818966B2 Resistive random access memory and manufacturing method thereof Public/Granted day:2023-11-14
Information query
IPC分类: