Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SAME
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Application No.: US17969966Application Date: 2022-10-20
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Publication No.: US20230137846A1Publication Date: 2023-05-04
- Inventor: Junhyeok AHN , Sohyun PARK , Hyosub KIM
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0146063 20211028
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
Provided is a semiconductor device including a substrate including a cell array area and a peripheral circuit area and including a plurality of first active areas defined in the cell array area and at least one second active area defined in the peripheral circuit area; a plurality of bit lines arranged in the cell array area of the substrate and extending in a first direction; a plurality of cell pad structures arranged between the bit lines and each including a first conductive layer, a first intermediate layer, and a first metal layer that are sequentially arranged on a top surface of the first active area; and a peripheral circuit gate electrode disposed on the peripheral circuit area of the substrate and including a second conductive layer, a second intermediate layer, and a second metal layer sequentially arranged on the at least one second active area.
Information query
IPC分类: