Invention Application
- Patent Title: MULTILAYER CAPACITOR
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Application No.: US17726880Application Date: 2022-04-22
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Publication No.: US20230139075A1Publication Date: 2023-05-04
- Inventor: Jang Ho LEE , Ki Pyo HONG , Sung Hoon KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0150400 20211104
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/232

Abstract:
A multilayer capacitor includes: a body including a multilayer structure in which one or more first internal electrodes and one or more second internal electrodes are alternately stacked in a first direction with one or more dielectric layers interposed therebetween; and first and second external electrodes disposed on the body and spaced apart from each other to be connected to the first internal electrodes and the second internal electrodes, respectively. The body further includes: a plurality of side margin layers with the multilayer structure interposed therebetween in a second direction, perpendicular to the first direction; and one or more edge margin portions for providing a margin between an edge of at least one of the side margin layers in a third direction and the multilayer structure, and between an edge of at least one of the side margin layers in the first direction and the multilayer structure.
Public/Granted literature
- US12142435B2 Multilayer capacitor Public/Granted day:2024-11-12
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