Invention Publication
- Patent Title: CONDUCTIVE FILM
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Application No.: US18327731Application Date: 2023-06-01
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Publication No.: US20240004504A1Publication Date: 2024-01-04
- Inventor: Shigehide ITOH
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 22105745 2022.06.30
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F3/041

Abstract:
Provided is a conductive film in which wire visibility of a metal wire is suppressed and visibility is improved. The conductive film includes a substrate and a conductive layer that is disposed on the substrate and consists of a metal wire, with a width of 2 μm or less, a height of 1 μm or less, and the metal wire has a metal layer, a first blackening layer, and a second blackening layer in this order from a side of the substrate. The first and second blackening layers contain a metal atom and at least one selected from the group consisting of an oxygen atom and a nitrogen atom. In the first blackening layer, a content of the metal atom at an intermediate position in a thickness direction is larger than a content of the metal atom at an intermediate position in the second blackening layer in a thickness direction.
Public/Granted literature
- US12141407B2 Conductive film Public/Granted day:2024-11-12
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