Invention Publication
- Patent Title: CONDUCTIVE FILM
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Application No.: US18327733Application Date: 2023-06-01
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Publication No.: US20240004505A1Publication Date: 2024-01-04
- Inventor: Hideki TOMIZAWA
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 22105430 2022.06.30
- Main IPC: G06F3/044
- IPC: G06F3/044 ; B32B27/08 ; B32B27/40

Abstract:
Provided is a conductive film having excellent conductivity in a case where a bending test is carried out after storage in a high-temperature and high-humidity environment. The conductive film includes a resin base material, a copper wire that is disposed on the resin base material, and a coating layer that covers a surface of the copper wire, where the coating layer contains a metal nanowire and a hydrophobic resin.
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