- 专利标题: INDUCTOR AND INDUCTOR MANUFACTURING METHOD
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申请号: US18205564申请日: 2023-06-04
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公开(公告)号: US20240006113A1公开(公告)日: 2024-01-04
- 发明人: Zuei-Chown Jou , Chih-Ho Liu , Jui-Wen Kuo , Chi-Ming Huang , Bo-Yu Huang , Yao-Tsung Chen
- 申请人: DARFON ELECTRONICS CORP.
- 申请人地址: TW Taoyuan City
- 专利权人: DARFON ELECTRONICS CORP.
- 当前专利权人: DARFON ELECTRONICS CORP.
- 当前专利权人地址: TW Taoyuan City
- 优先权: TW 1124718 2022.07.01
- 主分类号: H01F27/28
- IPC分类号: H01F27/28 ; H01F27/29 ; H01F27/32 ; H01F41/10 ; H01F41/02
摘要:
An inductor includes a coil, a conductive lead frame, and a housing. The coil includes a coil body and a lead protruding from the coil body. The lead has a U-bend portion. The lead is electrically fixed onto the conductive lead frame. The housing encapsulates the coil and exposes the conductive lead frame. A method of manufacturing an inductor includes the following steps: providing a coil, providing a conductive lead frame, making a lead of the coil be electrically fixed onto the conductive lead frame, bending the lead to form a U-bend portion and make the main body of the coil close to a portion of the lead that connects with the conductive lead frame, and forming a housing to encapsulate the coil and expose the conductive lead frame.
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