Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE INCLUDING PAD PATTERN
-
Application No.: US18216269Application Date: 2023-06-29
-
Publication No.: US20240008265A1Publication Date: 2024-01-04
- Inventor: Jaepil Lee , Junbae Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220081374 2022.07.01
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L23/522 ; H01F17/00

Abstract:
A semiconductor device includes a lower structure, a data storage structure on the lower structure, and an inductor structure on the lower structure, where the data storage structure includes first electrodes extending in a vertical direction perpendicular to an upper surface of the lower structure, a second electrode provided on the first electrodes, and a dielectric layer between the first electrodes and the second electrode, and where the inductor structure includes an inductor conductive pattern at a level that is substantially the same as a level of the first electrodes.
Information query