A method of fabricating a semiconductor package includes: providing a first die group including a plurality of first dies stacked parallel to a front surface of the first die group; providing a second die group including a plurality of second dies parallel to a front surface of the second die group; providing a base substrate structure comprising a substrate characterized by a lattice crystalline plane extending in a third direction; bonding the first die group on the base substrate structure, wherein the first edge extends in a first direction, and the first direction and the third direction define a first angle; and bonding the second die group on the base substrate structure, wherein the second edge extends in a second direction, and the second direction and the third direction define a second angle, and at least one of the first angle and the second angle is not zero.