Invention Publication
- Patent Title: THERMOPLASTIC RESIN EXPANDED BEAD AND MOLDED ARTICLE OF THERMOPLASTIC RESIN EXPANDED BEADS
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Application No.: US18349308Application Date: 2023-07-10
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Publication No.: US20240018325A1Publication Date: 2024-01-18
- Inventor: Takumi SAKAMURA , Hajime OHTA
- Applicant: JSP CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSP CORPORATION
- Current Assignee: JSP CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 22112865 2022.07.14
- Main IPC: C08J9/228
- IPC: C08J9/228 ; C08L23/14

Abstract:
A thermoplastic resin expanded bead and a molded article composed of the thermoplastic resin expanded beads are provided. The expanded bead includes a foam layer containing a thermoplastic resin. The expanded bead has a columnar shape, and has two or more and eight or less through-holes penetrating in the axial direction thereof. A ratio Ct/A of a total cross-sectional area Ct of the through-holes to a cross-sectional area A of the expanded bead in a cut surface obtained by cutting the expanded bead along a plane perpendicular to the axial direction at the center in the axial direction is 0.02 or more and 0.15 or less.
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