Invention Publication
- Patent Title: Thin-Film Capacitor Core
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Application No.: US18036426Application Date: 2021-10-19
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Publication No.: US20240021374A1Publication Date: 2024-01-18
- Inventor: Jintao LIN , Shaohan LAN , Wengang ZHANG
- Applicant: XIAMEN FARATROINIC CO., LTD.
- Applicant Address: CN Fujian
- Assignee: XIAMEN FARATROINIC CO., LTD.
- Current Assignee: XIAMEN FARATROINIC CO., LTD.
- Current Assignee Address: CN Fujian
- Priority: CN 2011267506.0 2020.11.13
- International Application: PCT/CN2021/124640 2021.10.19
- Date entered country: 2023-05-11
- Main IPC: H01G4/224
- IPC: H01G4/224 ; H01G4/33 ; H05K1/18

Abstract:
A thin-film capacitor core that has a core body, a covering film and a sprayed metal coating provided at two ends of the core body to form electrodes. The covering film is wound around an outer circumferential surface of the core body; the covering film has a base film and a waterproof layer attached to the base film. A waterproof covering process for the thin-film capacitor core can be performed by means of winding using a winding machine for producing a core body, such that on the premise of ensuring production efficiency of the thin-film capacitor core, the moisture resistance of the thin-film capacitor core is improved. A thin-film capacitor loaded with the thin-film capacitor core, and a printed circuit board loaded with the thin-film capacitor are also provided.
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