Invention Publication
- Patent Title: COIL COMPONENT AND MANUFACTURING METHOD FOR THE SAME
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Application No.: US18381797Application Date: 2023-10-19
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Publication No.: US20240047119A1Publication Date: 2024-02-08
- Inventor: Jae Hun KIM , Byeong Cheol MOON
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20190025944 2019.03.06
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F41/04

Abstract:
A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.
Information query