Semiconductor devices, such as memory devices, and associated systems and methods, are disclosed herein. A representative semiconductor device comprises a substrate including a plurality of conductive contacts and a mask material having a surface. The mask material includes (a) a first recess formed in the surface having a first depth and (b) a second recess formed in the surface having a second depth greater than the first depth. An exposed portion of each of the conductive contacts is exposed from the mask material in the second recess. The semiconductor device further comprises a semiconductor die including a lower surface having bond pads, and the lower surface is positioned in the first recess. The semiconductor device further comprises a plurality of conductive features electrically coupling individual ones of the bond pads to corresponding ones of the exposed portions of the conductive contacts.