Invention Publication
- Patent Title: MONOLITHIC THREE-DIMENSIONAL (3D) COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) CIRCUITS AND METHOD OF MANUFACTURE
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Application No.: US17818048Application Date: 2022-08-08
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Publication No.: US20240047455A1Publication Date: 2024-02-08
- Inventor: Xia Li , Bin Yang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/8238 ; H03K19/0948

Abstract:
A monolithic 3D complementary field-effect transistor (FET) (CFET) circuit includes a first CFET structure and a second CFET structure in a logic circuit within a device layer. A first interconnect layer disposed on the device layer provides first and second input contacts and an output contact of a logic circuit. Each CFET structure includes an upper FET having a first type (e.g., P-type or N-type) on a lower FET having a second type (e.g., N-type or P-type). The FETs in the monolithic 3D CFET circuit may be interconnected to form a two-input NOR circuit or a two-input NAND circuit. Vertical access interconnects (vias) may be formed within the device layer to interconnect the FETs externally and to each other. The FETs may be formed as bulk-type transistors or SOI transistors.
Information query
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