Invention Publication
- Patent Title: LAMINATES, PACKAGING MATERIALS AND PACKAGING BAGS
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Application No.: US18383830Application Date: 2023-10-25
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Publication No.: US20240051276A1Publication Date: 2024-02-15
- Inventor: Shinya OCHIAI , Shunichi SHIOKAWA , Ryo TAKEI
- Applicant: TOPPAN INC.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN INC.
- Current Assignee: TOPPAN INC.
- Current Assignee Address: JP Tokyo
- Priority: JP 21074071 2021.04.26 JP 21135563 2021.08.23 JP 21135564 2021.08.23 JP 21135565 2021.08.23 JP 22006247 2022.01.19
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B27/32 ; B32B27/16 ; B32B27/34 ; B65D65/40
Abstract:
A laminate includes a protective layer; a substrate layer; and a sealant layer, laminated in this order, wherein the substrate layer and the sealant layer contain polyethylene, the protective layer contains a thermosetting resin or a resin having a melting point of 160° C. or higher, and a ratio of polyethylene in the laminate is 90 mass % or more.
Information query
