Invention Publication
- Patent Title: TUNGSTEN WIRE, AND TUNGSTEN WIRE PROCESSING METHOD AND ELECTROLYTIC WIRE USING THE SAME
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Application No.: US18492929Application Date: 2023-10-24
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Publication No.: US20240052461A1Publication Date: 2024-02-15
- Inventor: Hitoshi AOYAMA , Hideaki BABA , Masanori MIZOBE , Kenji TOMOKIYO
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA MATERIALS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA MATERIALS CO., LTD.
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA MATERIALS CO., LTD.
- Current Assignee Address: JP Tokyo; JP Yokohama-shi
- Priority: JP 21074583 2021.04.27
- Main IPC: C22C27/04
- IPC: C22C27/04 ; B21C1/00 ; B22F5/12 ; B23H3/00 ; G01R1/067
Abstract:
According to one embodiment, a tungsten wire includes a tungsten alloy containing rhenium. The tungsten wire includes a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter.
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