- 专利标题: THERMAL MANAGEMENT FOR ELECTRONIC COMPONENTS
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申请号: US17885376申请日: 2022-08-10
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公开(公告)号: US20240057299A1公开(公告)日: 2024-02-15
- 发明人: Deepak Nayak , Hemant Mohan
- 申请人: Seagate Technology LLC
- 申请人地址: US CA Fremont
- 专利权人: Seagate Technology LLC
- 当前专利权人: Seagate Technology LLC
- 当前专利权人地址: US CA Fremont
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A data storage system includes an enclosure, a printed circuit board positioned in the enclosure, an integrated circuit mechanically and electrically coupled to the printed circuit board, temperature sensors configured to generate temperature signals in response to measured temperatures, an air mover coupled to the enclosure and including a motor rotatable in a clockwise direction and a counterclockwise direction, and a controller configured to cause rotation of the motor in either the clockwise direction or the counterclockwise direction depending on the temperature signals.
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