Invention Publication
- Patent Title: STAGGERED MATERIALS CORNER STRUCTURE FOR ELECTRONIC DEVICE ENCLOSURE
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Application No.: US17899902Application Date: 2022-08-31
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Publication No.: US20240069592A1Publication Date: 2024-02-29
- Inventor: Wen-Chih Chen , Po-Feng Chuang
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/04

Abstract:
An enclosure for an electronic device has a staggered materials corner structure. The enclosure includes an integral metal frame defining exterior sides of the enclosure. The integral metal frame has a tab inset and not visible at a corner of the enclosure. The enclosure includes either or both of first and second materials molded around the tab. The tab of the integral metal frame and either or both of the first and second materials define the staggered materials corner structure of the enclosure.
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