- 专利标题: Using supplementary and secondary alignments to improve compression of genomic alignment files
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申请号: US17938980申请日: 2022-09-07
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公开(公告)号: US20240079095A1公开(公告)日: 2024-03-07
- 发明人: Divon Mordechai Lan
- 申请人: Divon Mordechai Lan
- 申请人地址: TH Bangkok
- 专利权人: Divon Mordechai Lan
- 当前专利权人: Divon Mordechai Lan
- 当前专利权人地址: TH Bangkok
- 主分类号: G16B50/50
- IPC分类号: G16B50/50 ; G06F16/174 ; G16B30/10
摘要:
The present invention discloses an advance methodology for using supplementary and secondary alignments to improve compression of genomic alignment file and method for exploiting information redundancies that exist in a between a primary alignment and secondary or supplementary alignments of the same read, to improve the compression of aligned genomic data. The method is implemented to compress SAM/BAM files, but in the future, it could be used to compress other file formats of aligned genomic data.
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