- 专利标题: METHOD AND LASER PROCESSING APPARATUS FOR PRODUCING A BIPOLAR PLATE
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申请号: US18515340申请日: 2023-11-21
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公开(公告)号: US20240082953A1公开(公告)日: 2024-03-14
- 发明人: Jan-Patrick Hermani , Martin Stambke
- 申请人: TRUMPF Laser GmbH
- 申请人地址: DE Schramberg
- 专利权人: TRUMPF Laser GmbH
- 当前专利权人: TRUMPF Laser GmbH
- 当前专利权人地址: DE Schramberg
- 优先权: DE 2021113597.4 2021.05.26
- 主分类号: B23K26/24
- IPC分类号: B23K26/24 ; B23K26/08
摘要:
A method for producing a bipolar plate includes providing a first plate element and a second plate element. The first plate element has at least one bead with a longitudinal extent. The method further includes forming a welded connection between the first plate element and the second plate element along the longitudinal extent by using a laser processing beam. The formation of the welded connection includes detecting a geometric feature of the at least one bead located in a transverse direction. The geometric feature is a deepest point or a point of defined depth of the at least one bead. The formation of the welded connection further includes readjusting the laser processing beam in the transverse direction to a position of the detected geometric feature, and welding the first plate element and the second plate element together at the position of the geometric feature.
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