- 专利标题： SOLVENT-FREE RESIN COMPOSITION AND USES OF THE SAME
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申请号： US18049003申请日： 2022-10-24
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公开(公告)号： US20240084063A1公开(公告)日： 2024-03-14
- 发明人: Jui-Hsiang TANG , Shur-Fen LIU
- 申请人： TAIWAN UNION TECHNOLOGY CORPORATION
- 申请人地址： TW Zhubei City
- 专利权人： TAIWAN UNION TECHNOLOGY CORPORATION
- 当前专利权人： TAIWAN UNION TECHNOLOGY CORPORATION
- 当前专利权人地址： TW Zhubei City
- 优先权： TW 1134189 2022.09.08
- 主分类号： C08F279/02
- IPC分类号： C08F279/02 ; C08F222/06 ; C08K3/22 ; C08K3/36 ; H05K3/00
摘要：
A solvent-free resin composition and uses thereof are provided. The resin composition includes:
(A) a maleic acid-modified liquid hydrocarbon resin;
(B) a first filler having a D50 particle size of 1 μm to 4 μm; and
(C) a second filler having a D50 particle size of 5 μm to 10 μm.
The solvent-free resin composition can be used to fill the holes of printed circuit boards.
(A) a maleic acid-modified liquid hydrocarbon resin;
(B) a first filler having a D50 particle size of 1 μm to 4 μm; and
(C) a second filler having a D50 particle size of 5 μm to 10 μm.
The solvent-free resin composition can be used to fill the holes of printed circuit boards.
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