Invention Publication
- Patent Title: HOT-MELT PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET
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Application No.: US18275053Application Date: 2022-01-26
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Publication No.: US20240093060A1Publication Date: 2024-03-21
- Inventor: Akinori TAMURA , Itsuhiro HATANAKA , Nobukazu NEGISHI
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Priority: JP 21014456 2021.02.01
- International Application: PCT/JP2022/002867 2022.01.26
- Date entered country: 2023-07-31
- Main IPC: C09J7/10
- IPC: C09J7/10 ; C09J7/35 ; C09J7/38

Abstract:
Provided is a hot-melt PSA composition having a low viscosity when melted with heat and capable of suitably forming a PSA layer. A hot-melt PSA composition comprising a base polymer is provided. The base polymer comprises acrylic polymers A and B. The acrylic polymer A is a polymer of monomers comprising, as the primary component, a (meth)acrylic monomer A having an alkyl group with 4 to 8 carbon atoms. The acrylic polymer B is a polymer of monomers comprising, as a primary component, a (meth)acrylic monomer B having an alkyl group with 9 to 12 carbon atoms. In the base polymer, with the total amount of the acrylic polymers A and B being 100% by weight, the acrylic polymer B content is 10% by weight or more and 90% by weight or less.
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