Invention Publication
US20240094313A1 SENSOR
审中-公开
- Patent Title: SENSOR
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Application No.: US18524904Application Date: 2023-11-30
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Publication No.: US20240094313A1Publication Date: 2024-03-21
- Inventor: Hiromichi UMEHARA , Keita KAWAMORI , Kenzo MAKINO , Masachika HASHINO
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 22134769 2022.08.26
- Main IPC: G01R33/09
- IPC: G01R33/09 ; G01R33/00

Abstract:
A magnetic sensor includes an insulating layer, a first MR element, and a second MR element. The insulating layer includes a first layer and a second layer, and also includes first and second inclined surfaces formed across the first layer and the second layer. Each of the first and second MR elements includes a magnetization pinned layer and a free layer. The magnetization pinned layer and the free layer of the first MR element are disposed on the first inclined surface. The magnetization pinned layer and the free layer of the second MR element are disposed on the second inclined surface.
Public/Granted literature
- US12235334B2 Sensor including at least one inclined surface Public/Granted day:2025-02-25
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