There is provided a system and method for defect examination on a semiconductor specimen. The method comprises obtaining an original image of the semiconductor specimen, the original image having a first region annotated as enclosing a defective feature; specifying a second region in the original image containing the first region, giving rise to a contextual region between the first region and the second region; identifying in a target image of the specimen a set of candidate areas matching the contextual region in accordance with a matching measure; selecting one or more candidate areas from the set of candidate areas; and pasting the first region or part thereof with respect to the one or more candidate areas, giving rise to an augmented target image usable for defect examination on the semiconductor specimen.