Invention Publication
- Patent Title: COIL DEVICE
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Application No.: US18465449Application Date: 2023-09-12
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Publication No.: US20240096547A1Publication Date: 2024-03-21
- Inventor: Tomohiro FURUICHI , Masaru KUMAGAI , Takuma TANAKA
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 22147105 2022.09.15
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/02 ; H01F27/28 ; H01F27/29

Abstract:
The present disclosure provides a coil device that can be reduced in height, has a small installation area of a case, and is excellent in heat dissipation. A coil device according to the present disclosure includes: a device body including a bobbin and a coil unit of a wire wound around the bobbin; a terminal block arranging a lead portion drawn out from a wire of the coil unit thereon; and a case capable of accommodating the device body. The case includes a support arm extending outside the case, and the terminal block is held by the support arm.
Information query