- 专利标题: Resonator and Preparation Method Thereof
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申请号: US18515999申请日: 2023-11-21
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公开(公告)号: US20240097641A1公开(公告)日: 2024-03-21
- 发明人: Wei Wu , Hao Li , Jinhui Wang , Wei Li
- 申请人: Huawei Technologies Co., Ltd.
- 申请人地址: CN Shenzhen
- 专利权人: Huawei Technologies Co., Ltd.
- 当前专利权人: Huawei Technologies Co., Ltd.
- 当前专利权人地址: CN Shenzhen
- 优先权: CN 2110554828.1 2021.05.21 CN 2110700269.0 2021.06.23
- 主分类号: H03H9/02
- IPC分类号: H03H9/02 ; H03H3/02
摘要:
A resonator includes a resonance layer, a substrate, and a barrier layer. The barrier layer is located on the substrate, and the barrier layer and the substrate form a cavity. The cavity is configured to accommodate the resonance layer. The barrier layer includes a top wall and a side wall, and an inner surface of the side wall surrounds the resonance layer. An outer surface of the side wall includes a groove, and the groove surrounds the side wall.
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