Invention Publication
- Patent Title: INTEGRATED CIRCUIT WITH BIOFETS
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Application No.: US18525583Application Date: 2023-11-30
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Publication No.: US20240102959A1Publication Date: 2024-03-28
- Inventor: Tung-Tsun CHEN , Yi-Hsing HSIAO , Jui-Cheng HUANG , Yu-Jie HUANG
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- The original application number of the division: US17007973 2020.08.31
- Main IPC: G01N27/414
- IPC: G01N27/414 ; G01N33/569 ; H01L21/762

Abstract:
An IC structure includes a biologically sensitive field-effect transistor (BioBET) in a semiconductor substrate, and a dielectric layer over a backside surface of the semiconductor substrate. The dielectric layer has a sensing well extending through the dielectric layer to a channel region of the BioFET. The IC structure further includes a biosensing film, a plurality of fluid channel walls, and a first heater. The biosensing film lines the sensing well in the dielectric layer. The fluid channel walls are over the biosensing film and define a fluid containment region over the sensing well of the dielectric layer. The first heater is in the semiconductor substrate. The first heater has at least a portion overlapping with the fluid containment region.
Public/Granted literature
- US12222317B2 Integrated circuit with BioFETs Public/Granted day:2025-02-11
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