Invention Publication
- Patent Title: Implant Delivery System
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Application No.: US18539170Application Date: 2023-12-13
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Publication No.: US20240108352A1Publication Date: 2024-04-04
- Inventor: Tai D. Tieu , Hideo Morita , Helen Nguyen
- Applicant: MicroVention, Inc.
- Applicant Address: US CA Aliso Viejo
- Assignee: MicroVention, Inc.
- Current Assignee: MicroVention, Inc.
- Current Assignee Address: US CA Aliso Viejo
- Main IPC: A61B17/12
- IPC: A61B17/12 ; A61B90/00 ; A61F2/01 ; A61F2/95

Abstract:
An implant delivery system may have a pusher. The pusher may have an elongated shape. A distal end of the pusher may be configured to connect to an implant. The implant delivery system may have a tether connected to the pusher and to the implant. The implant delivery system may have a heating element mounted over the tether biased to contract a first surface of the heating element towards a second surface of the pusher. The implant delivery system may have an expander disposed between the first surface of the heating element and the second surface of the pusher. The expander may be configured to melt, allowing the first surface to contact the second surface, upon activation of the heating element.
Public/Granted literature
- US12295583B2 Implant delivery system Public/Granted day:2025-05-13
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