- 专利标题: FLOOR PANEL FOR FORMING A FLOOR COVERING
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申请号: US18531277申请日: 2023-12-06
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公开(公告)号: US20240110387A1公开(公告)日: 2024-04-04
- 发明人: Jan Eddy DE RICK , Pieter DEVOS
- 申请人: FLOORING INDUSTRIES LIMITED, SARL
- 申请人地址: LU Bertrange
- 专利权人: FLOORING INDUSTRIES LIMITED, SARL
- 当前专利权人: FLOORING INDUSTRIES LIMITED, SARL
- 当前专利权人地址: LU Bertrange
- 优先权: BE 165011 2016.01.08 DE 2016102034.4 2016.04.18
- 主分类号: E04F15/02
- IPC分类号: E04F15/02 ; E04F15/10
摘要:
A floor panel for forming a floor covering, wherein the floor covering consists of floor panels, which, on at least one pair of edges, are provided with coupling parts. The coupling parts substantially are manufactured from the material of the floor panel, and the coupling parts are configured such that two such floor panels, at the pair of edges, can be installed and locked to each other by means of a downward movement and/or by means of the fold-down principle.
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