Invention Publication
- Patent Title: LASER MODULE
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Application No.: US18537885Application Date: 2023-12-13
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Publication No.: US20240113495A1Publication Date: 2024-04-04
- Inventor: MITSUOKI HISHIDA
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Priority: JP 21122249 2021.07.27
- Main IPC: H01S5/02208
- IPC: H01S5/02208

Abstract:
A plurality of recesses (15) is formed in a surface of first block (10), the surface facing second block (20). The plurality of recesses (15) are formed in a region different from a region in which laser element (40) is disposed when viewed from a direction in which first block (10) and second block (20) are stacked. Each of recesses (15) is provided with a spacer member (50) having insulation properties. Spacer member (50) partly protrudes from corresponding recess (15). Spacer member (50) is sandwiched between first block (10) and second block (20).
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