Invention Publication
- Patent Title: SIDELINK FEEDBACK FOR INCREASED CAPACITY
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Application No.: US17958042Application Date: 2022-09-30
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Publication No.: US20240114495A1Publication Date: 2024-04-04
- Inventor: Chih-Hao Liu , Xiaoxia Zhang , Jing Sun , Giovanni Chisci , Stelios Stefanatos
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04W72/04
- IPC: H04W72/04 ; H04L27/26 ; H04W52/16 ; H04W52/36

Abstract:
Methods, systems, and devices for wireless communications are described. Generally, the described techniques provide for a user equipment (UE) to transmit feedback information via a configurable quantity of interlaced resource blocks (IRBs) in one or more interlaces of a sidelink feedback channel. For example, the UE may transmit feedback via multiple IRBs of an interlace. The UE may determine which IRBs to use in accordance with a configuration, which may indicate a quantity of IRBs, a distribution of the IRBs, a pattern of the IRBs, or any combination thereof. Additionally, or alternatively, the UE may determine to transmit feedback via multiple IRBs of an interlace that is different from a common interlace.
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