Invention Publication
- Patent Title: UPLINK SUBBAND FOR INITIAL ACCESS
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Application No.: US18348769Application Date: 2023-07-07
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Publication No.: US20240114547A1Publication Date: 2024-04-04
- Inventor: Muhammad Sayed Khairy ABDELGHAFFAR , Qian ZHANG , Abdelrahman Mohamed Ahmed Mohamed IBRAHIM , Ahmed Attia ABOTABL , Gokul SRIDHARAN , Hung Dinh LY
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04W74/00
- IPC: H04W74/00 ; H04L5/14 ; H04W74/08
Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive system information for performing an initial access procedure using an uplink subband of subband full-duplex symbols. The UE may transmit an initial access message in the uplink subband. Numerous other aspects are described.
Information query
