Assemblies, apparatus, and methods for heat sealing and monitoring are disclosed. A dual heat-sealing system includes a heat seal bar assembly with process monitor that allows to quickly change out heat bands and ensure that the effective length of the heat band matches the width of the seal (of the material being sealed), providing consistent and superior seal quality. A heat seal bar assembly includes multiple heat bars sized to easily match the size of the pouch being sealed. The heat bars are removable and replaceable. The heat bars are provided with at least one memory chip. The memory chip allows for storage and retrieval of information regarding the replaceable heat bar.