An electronic-component-attached resin housing is provided that comprises a housing and an electronic component mounting film. The housing is made of resin. The electronic component mounting film includes a base film, a circuit pattern layer, an electronic component, and a reinforcing layer. The base film is disposed along an inner surface of the housing. The circuit pattern layer is formed on at least a surface of the base film opposite to a housing side of the base film. The electronic component is connected to the circuit pattern layer and mounted on the surface of the base film opposite to the housing side of the base film. The reinforcing layer is formed on the housing side of the base film facing the electronic component. The electronic component is integrated with the housing without the electronic component being buried in the housing.