Invention Publication
- Patent Title: TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
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Application No.: US18213967Application Date: 2023-06-25
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Publication No.: US20240136237A1Publication Date: 2024-04-25
- Inventor: Changui Hong , Minho Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220134610 2022.10.18
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01R31/52 ; G01R31/64 ; H01L23/498

Abstract:
A substrate includes a first input/output region; a first input pad provided in the first input/output region; a first output pad provided in the first input/output region; a first mounting region; a first positive pad provided in the first mounting region and connected to the first input pad; a first negative pad provided in the first mounting region connected to the first output pad; a second positive pad provided in the first mounting region; a second negative pad provided in the first mounting region; a second mounting region; a third positive pad provided in the second mounting region and connected to the second positive pad; a third negative pad provided in the second mounting region and connected to the second negative pad; a fourth positive pad provided in the second mounting region; a fourth negative pad provided in the second mounting region; a second input/output region; a second input pad provided in the second input/output region and connected to the fourth positive pad; and a second output pad provided in the second input/output region and connected to the fourth negative pad.
Public/Granted literature
- US20240234221A9 TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD Public/Granted day:2024-07-11
Information query
IPC分类: