• Patent Title: ULTRASOUND TRANSDUCER AND METHOD FOR PRODUCING AN ULTRASOUND TRANSDUCER
  • Application No.: US18488772
    Application Date: 2023-10-17
  • Publication No.: US20240139774A1
    Publication Date: 2024-05-02
  • Inventor: David CheynsYongbin Jeong
  • Applicant: IMEC VZW
  • Applicant Address: BE Leuven
  • Assignee: IMEC VZW
  • Current Assignee: IMEC VZW
  • Current Assignee Address: BE Leuven
  • Priority: EP 204493.5 2022.10.28
  • Main IPC: B06B1/06
  • IPC: B06B1/06 H10N39/00
ULTRASOUND TRANSDUCER AND METHOD FOR PRODUCING AN ULTRASOUND TRANSDUCER
Abstract:
A method is provided for producing an ultrasound transducer for an ultrasound system. The method includes: 1) forming a first layer structure, comprising: (a) forming a frontplane flexible layer above a first substrate; (b) forming an array of ultrasound transducer elements; and 2) providing a second layer structure comprising at least a backplane layer; wherein 1) and/or 2) comprises: 1) (c) forming a first cavity defining layer above the array of ultrasound transducer elements and/or 2) (a) forming a second cavity defining layer above the backplane layer; and defining an array of cavities in the first and/or second cavity defining layer; 3) attaching by adhesive bonding the first layer structure to the second layer structure with the array of ultrasound transducer elements between the frontplane flexible layer and the backplane layer; and 4) removing the first substrate.
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