Invention Publication
- Patent Title: ULTRASOUND TRANSDUCER AND METHOD FOR PRODUCING AN ULTRASOUND TRANSDUCER
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Application No.: US18488772Application Date: 2023-10-17
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Publication No.: US20240139774A1Publication Date: 2024-05-02
- Inventor: David Cheyns , Yongbin Jeong
- Applicant: IMEC VZW
- Applicant Address: BE Leuven
- Assignee: IMEC VZW
- Current Assignee: IMEC VZW
- Current Assignee Address: BE Leuven
- Priority: EP 204493.5 2022.10.28
- Main IPC: B06B1/06
- IPC: B06B1/06 ; H10N39/00

Abstract:
A method is provided for producing an ultrasound transducer for an ultrasound system. The method includes: 1) forming a first layer structure, comprising: (a) forming a frontplane flexible layer above a first substrate; (b) forming an array of ultrasound transducer elements; and 2) providing a second layer structure comprising at least a backplane layer; wherein 1) and/or 2) comprises: 1) (c) forming a first cavity defining layer above the array of ultrasound transducer elements and/or 2) (a) forming a second cavity defining layer above the backplane layer; and defining an array of cavities in the first and/or second cavity defining layer; 3) attaching by adhesive bonding the first layer structure to the second layer structure with the array of ultrasound transducer elements between the frontplane flexible layer and the backplane layer; and 4) removing the first substrate.
Information query
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